Solder Wire
Solder Wire Form Flux-Cored Wire Material Composition 99.3 Percent Tin 0.6 Percent Copper 0.05 Percent Nickel Wire Diameter 1 mm Weight 100 g Melting Temperature (Minimum) 442 Degrees F Melting Temperature (Maximum) 444 Degrees F Flux Type No-Clean Flux Classification ROM1 Solder Series SCN M1 For Joining Metal Application High Soldering Temperature Container Type Spool
Standard shipping
Estimated delivery time: 7-10 days